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A method to detect counterfeit integrated circuits through the use of a microwave resonator
TS-048646 — A novel method to detect a counterfeit integrated circuit (IC) and to authenticate an IC using the electromagnetic characteristics of the IC and a resonator
The presence of counterfeit integrated circuits (commonly referred to as “ICs” or “chips”) in a supply chain, such as a military supply chain, can result in either a failure of a critical system or a compromise of the data on that system. These counterfeit chips may not be …
  • College: College of Engineering (COE)
  • Inventors: Lee, Robert; Gildenmeister, Kraig
  • Licensing Officer: Hong, Dongsung

Photon-assisted MOCVD growth of II-IV-N2, II-III2-IV-N4 semiconductors and their heterostructures with III-N
TS-048645 — A novel photon-assisted MOCVD growth method to synthesize II-IV-N2 materials
Zn-IV-N2 and Mg-IV-N2 compounds have been reported to be synthesized by a number of techniques including chemical vapor deposition (CVD), vapor-liquid-solid (VLS) technique, ammonothermal synthesis, radio frequency (RF) sputtering, pulsed laser deposition, molecular beam epitaxy (MBE) and metalorg…
  • College: College of Engineering (COE)
  • Inventors: Zhao, Hongping; Rezaul Karim, Md
  • Licensing Officer: Hong, Dongsung

Dielectric heterojunction device
TS-048644 — The potential of different materials for vertical power switching is often assessed by calculating the Baliga Figure of Merit (BFOM). In the case of wide and ultra-wide bandgap materials, the high breakdown fields and the relatively good transport properties make the BFOM significantly higher than…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; Moore, Wyatt; Xia, Zhanbo
  • Licensing Officer: Hong, Dongsung

Capacitive Sensing Method for Integrated Circuit Identification and Authentication
TS-048641 — A method of authenticating an IC die’s origin and uniquely identifying each die with an intrinsic unclonable value through measurement of on-chip capacitance values
Hardware security in Integrated Circuit (IC) designs is of increasing importance in dealing with the insecure, expanding global supply chain of these parts. The ability to trace the origin of a die, combined with the capability to uniquely identify each die provides valuable quantitative measures …
  • College: College of Engineering (COE)
  • Inventors: Khalil, Waleed; Kines, Michael
  • Licensing Officer: Hong, Dongsung

High Permittivity Dielectric Junction Termination for Vertical High Voltage Devices
TS-048635 — A novel edge termination concept using extreme permittivity dielectrics is proposed to effectively manage peak electric fields in vertical power devices
Gallium Nitride (GaN)-based devices are promising for high frequency and power applications because they have a superior combination of the critical electric field, electron mobility, saturation drift velocity, and power density. With the recent interest in solid-state power electronics technologi…
  • College: College of Engineering (COE)
  • Inventors: Lee, Hyunsoo; Rahman, Mohammad Wahidur "Wahidur"; Rajan, Siddharth; Xia, Zhanbo
  • Licensing Officer: Hong, Dongsung

A proximity sensor for the detection of hands on a steering wheel
TS-048591 — An embedded coax proximity sensor for the detection of hands or other objects near a vehicle's steering wheel
The coming age of autonomous vehicles will require the development of many new technologies to keep the vehicle occupants safe even when no one is paying attention to the vehicle operation. At present, given the limited capabilities of autonomous vehicles, it is necessary for the driver to monitor…
  • College: College of Engineering (COE)
  • Inventors: Lee, Robert; Kiourti, Asimina; Wang, Zhenyu
  • Licensing Officer: Hong, Dongsung

A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
  • College: College of Engineering (COE)
  • Inventors: Lyu, Xintong; Wang, Jin
  • Licensing Officer: Hong, Dongsung

Method for Automatic Transmission Calibration and Controller Optimization
TS-048123 — A method for automatically calibrating and optimizing gear shift control parameters through iterative algorithms both during development and during use.
As fuel efficiency standards for modern cars increase, manufacturers are adding more and more gears to their transmissions. The higher number of gears allows for greater gear spread, meaning engineers can add taller gears that allow engines to operate at lower, more fuel-efficient rpms. Despite…
  • College: College of Engineering (COE)
  • Inventors: Mishra, Kirti; Srinivasan, Krishnaswamy
  • Licensing Officer: Gooray, Arthur "Art"

High-strength/high-ductility magnesium sheet alloy for room-temperature forming
TS-048065 — A new magnesium alloy designed using computational thermodynamic and kinetic models, which possesses optimal mechanical and formability performance suitable for industrial applications
Magnesium (Mg), the lightest structural metal, and its alloys, with their high specific strength and low density, are promising lightweight materials for industrial applications in automotive, aerospace, and electronic sectors. A 2019 report by Business Communications Company (BCC) Research highli…
  • College: College of Engineering (COE)
  • Inventors: Luo, Aihua (Alan); Shi, Renhai
  • Licensing Officer: Zinn, Ryan

3D subwavelength photonic detector coupled with dielectric resonator antenna
TS-047335 — New IR detector combining a dielectric resonator antenna (DRA) with a semiconductor absorber for improved signal, noise, and speed performance
The three essential characteristics of detectors are signal, noise, and speed. There are inherent trade-offs in these three figures of merit and various applications emphasize one or more characteristics. The primary limitation for infrared detectors and imagers is the limit on the achievable sign…
  • College: College of Engineering (COE)
  • Inventors: Krishna, Sanjay; Ball, Christopher; Grbic, Anthony; Kazemi, Alireza; Ranjbar, Amin; Ronningen, Theodore; Shu, Qingyuan
  • Licensing Officer: Hong, Dongsung

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