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A method to detect counterfeit integrated circuits through the use of a microwave resonator
TS-048646 — A novel method to detect a counterfeit integrated circuit (IC) and to authenticate an IC using the electromagnetic characteristics of the IC and a resonator
The presence of counterfeit integrated circuits (commonly referred to as “ICs” or “chips”) in a supply chain, such as a military supply chain, can result in either a failure of a critical system or a compromise of the data on that system. These counterfeit chips may not be …
  • College: College of Engineering (COE)
  • Inventors: Lee, Robert; Gildenmeister, Kraig
  • Licensing Officer: Hong, Dongsung

Photon-assisted MOCVD growth of II-IV-N2, II-III2-IV-N4 semiconductors and their heterostructures with III-N
TS-048645 — A novel photon-assisted MOCVD growth method to synthesize II-IV-N2 materials
Zn-IV-N2 and Mg-IV-N2 compounds have been reported to be synthesized by a number of techniques including chemical vapor deposition (CVD), vapor-liquid-solid (VLS) technique, ammonothermal synthesis, radio frequency (RF) sputtering, pulsed laser deposition, molecular beam epitaxy (MBE) and metalorg…
  • College: College of Engineering (COE)
  • Inventors: Zhao, Hongping; Rezaul Karim, Md
  • Licensing Officer: Hong, Dongsung

Capacitive Sensing Method for Integrated Circuit Identification and Authentication
TS-048641 — A method of authenticating an IC die’s origin and uniquely identifying each die with an intrinsic unclonable value through measurement of on-chip capacitance values
Hardware security in Integrated Circuit (IC) designs is of increasing importance in dealing with the insecure, expanding global supply chain of these parts. The ability to trace the origin of a die, combined with the capability to uniquely identify each die provides valuable quantitative measures …
  • College: College of Engineering (COE)
  • Inventors: Khalil, Waleed; Kines, Michael
  • Licensing Officer: Hong, Dongsung

A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
  • College: College of Engineering (COE)
  • Inventors: Lyu, Xintong; Wang, Jin
  • Licensing Officer: Hong, Dongsung

Extreme-Condition Sensors for Use with Electrical Capacitance VolumeTomography & Capacitance Sensing Applications
TS-037841 — A modular and non-invasive ECVT sensor that can be adapted and scaled to vessel demands.
Electrical Capacitance Volume Tomography (ECVT) is a non-invasive image reconstruction that provides volumetric images of a material. An ECVT system is generally comprised of a sensor, data acquisition system, computer system, and software for reconstruction of the 3D image. Capacitance data colle…
  • College: College of Engineering (COE)
  • Inventors: Marashdeh, Qussai; Alghothani, Yousef; Hudak, Jesse; Legg, Geoffrey; Straiton, Benjamin; Tong, Andrew
  • Licensing Officer: Norris, Francis "Frank"

Environmental and Ship Motion Forecasting Program
TS-037401 — A system that will enable prediction of ship motion in order to improve cargo transfer, helicopter landing, and other naval/commercial operations such as those related to offshore platforms or wave energy generation systems.
Instantaneous and predictive information about sea waves is critical to forecast ship motion, which is needed for many applications, such as cargo transfer and helicopter landing at sea. Scientists use radar to obtain this information, but several challenges must be overcome to develop a robust wa…
  • College: College of Engineering (COE)
  • Inventors: Johnson, Joel; Lyzenga, David; O'Brien, Andrew; Smith, Graeme
  • Licensing Officer: Hong, Dongsung

Fabrication of Nanopapers and Nanoparticle Reinforced Polymeric Composites Using Vacuum-Assisted Layer-by-Layer Spraying Technique
TS-037364 — A method to combine advantages of fiber-reinforced plastics and nanocomposites to produce a low-cost, superior lightweight material.
Nanomaterials, more specifically nanoparticle reinforced composites, are one of the best solutions for most lightweight applications. Due to the dispersion and high aspect ratio of nanoparticles, lightweight polymer nanocomposites exhibit dimensional stability, heat and flame resistance, barrier p…
  • College: College of Engineering (COE)
  • Inventors: Lee, L James; Guerra, Dante; Min, Yong Gang; Movva, Siva
  • Licensing Officer: Norris, Francis "Frank"

Battery consumption minimization strategy for plug-in, pure, and hybrid EVs
TS-036908 — An energy management strategy for pure and hybrid electric vehicles that improves battery-life and optimizes fuel economy
Automotive powertrains are increasingly more electric, from mild and full hybrid, to plug-in hybrid and battery electric, automotive propulsion is increasingly relying on electricity as a source of power assist, or as the sole source of power, in automotive vehicles. This is true for passenger, co…
  • College: College of Engineering (COE)
  • Inventors: Rizzoni, Giorgio; Tang, Li
  • Licensing Officer: Zinn, Ryan

A Voltage Divider based Auxiliary Power Unit for Power Electronic Converters
TS-035666 — A more reliable, less complex, and cost effective concept for providing auxiliary power to high voltage electronic converters without external power sources.
Power electronic converters need a certain type of auxiliary power unit to provide electric power to their controllers, gate-driving circuits and/or sensors. For power electronic converters used in high voltage systems, the auxiliary power unit is difficult to design and fabricate due to massive e…
  • College: College of Engineering (COE)
  • Inventors: Wang, Jin; Hu, Boxue; Li, He
  • Licensing Officer: Hong, Dongsung

Power Over Fiber Based Gate Drive Circuit
TS-015120 — The introduced power over fiber based gate drive circuit can be used drive semiconductor devices in a wide range of applications.
Recently, interest in high-voltage (HV) Silicon Carbide (SiC) based semiconductor power devices and their applications has grown. Many HV SiC based semiconductor power devices have been developed to date. The gate drive circuit of HV SiC power devices is critical to ensure fast and reliable switch…
  • College: College of Engineering (COE)
  • Inventors: Wang, Jin; Li, He; Zhang, Xuan
  • Licensing Officer: Hong, Dongsung

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