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A Gas-Assisted Resin Injection Technique for Bonding and Surface Modification of Microfluidic Devices
TS-037577 — A new resin gas-assisted injection technique, which can achieve both bonding and surface modification of microfluidic devices
The application of microfluidic platforms is limited because the materials and production methods are too expensive, and the material properties induce problems, such as a lack of optical clarity and low impact strength. Packaging (i.e. sealing a device with a lid) is also a challenge in the fabri…
  • College: College of Engineering (COE)
  • Inventors: Lee, L James; Lai, Siyi
  • Licensing Officer: Norris, Francis "Frank"

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