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A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
- College: College of Engineering (COE)
- Inventors: Lyu, Xintong; Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
Field Effect Transistor for High Power Millimeter-Wave Applications
TS-042088 — Transistor structure with high breakdown voltage at high frequency operation
A new generation of high throughput, efficient communication networks and sensors can be enabled through the use of millimeter scale wave regimes. However, current semiconductor materials (such as AlGaN/GaN) have a reduction in breakdown voltage as operating frequency increases, which leads to low…
- College: College of Engineering (COE)
- Inventors: Rajan, Siddharth; Wang, Caiyu; Xia, Zhanbo
- Licensing Officer: Zinn, Ryan
