Available Technologies
# of Displayed Technologies: 4 / 4
Applied Category Filter (Click To Remove): Semiconductors, Circuits, & Electronic Components
Utilization of Inductors in Electronics Circuits as Magnetohydrodynamics Pumps for Liquid Metal based Cooling
TS-062498 — Novel integrated inductor-based magnetohydrodynamic (MHD) pumps containing liquid metal coolant significantly enhance the thermal management of large-scale, complex electronic systems housed in confined spaces
Conventional thermal management methods such as air-cooling and liquid cooling methods commonly used for electronics present in laptops, desktop computers, and smaller electronic configurations show limitations when scaled up for complex electronics architectures. High-power and high-voltage elect…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
Utilization of Interconnections in Electronic Circuits as Magnetohydrodynamic Pumps for Liquid Metalbased Cooling
TS-062494 — A novel magnetohydrodynamic (MHD) pump-based thermal management system design where integration of the cooling apparatus using electronic circuit interconnections achieves improved thermal management at a lower cost.
Newer applications incorporating high-power electronics designs face greater thermal management challenges and impact systemic stability and reliability. Enhanced cooling techniques in these complex electronic systems rely on liquid cooling instead of air cooling. However, liquid cooling approache…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
Modular Dc Circuit Breaker with Integrated Energy Storage for Future Dc Networks
TS-051200 —
Traditional AC distribution is not suitable for a wide range of applications in regard to efficiency, cost, and power carrying capacity compared to alternative distributions. Low voltage distribution suffers from high transmission losses due to higher current requirements necessitating thicker, he…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Na, Risha; Zhang, Yue
- Licensing Officer: Ashouripashaki, Mandana
A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
- College: College of Engineering (COE)
- Inventors: Lyu, Xintong; Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
