Available Technologies
# of Displayed Technologies: 10 / 11
Applied Category Filter (Click To Remove): Electronics & Photonics
Cost-Effective Modular Multilevel Flying Capacitor Converter for HVDC and Grid Applications
TS-072584 — The Need
High-voltage DC (HVDC) transmission and grid-connected power conversion systems face significant cost, size, and efficiency challenges due to the large number of expensive submodules and capacitors required in conventional modular multilevel converters (MMC). These limitations restrict scal…
- College: College of Engineering (COE)
- Inventors: Fu, Pengyu; Cong, Yizhou; Ma, Dihao; Wang, Ke; Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
Flexible Light-Addressable Sensor for High-Resolution Physiological Mapping
TS-072319 — The Need
Current methods for mapping electrical potential gradients in biological tissues, such as the brain, rely on high-density electrode arrays fabricated via costly microfabrication techniques. These rigid devices struggle to conform to complex tissue morphologies, limiting their effectiveness …
- College: College of Engineering (COE)
- Inventors: Li, Jinghua; Chen, Shulin; Jia, Yizhen; Liu, Tzu Li; Wang, Qi
- Licensing Officer: Ashouripashaki, Mandana
Tunable Switched Impedance Matching Network (TSIMN)
TS-063058 — The Need
In the era of electrified vehicles, there is a growing demand for efficient power systems that can provide high voltage and/or high output power to meet strict design requirements. These power systems also need to supply power to other equipment and circuits, such as DC-DC converters, on-b…
- College: College of Engineering (COE)
- Inventors: Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
Utilization of Inductors in Electronics Circuits as Magnetohydrodynamics Pumps for Liquid Metal based Cooling
TS-062498 — Novel integrated inductor-based magnetohydrodynamic (MHD) pumps containing liquid metal coolant significantly enhance the thermal management of large-scale, complex electronic systems housed in confined spaces
Conventional thermal management methods such as air-cooling and liquid cooling methods commonly used for electronics present in laptops, desktop computers, and smaller electronic configurations show limitations when scaled up for complex electronics architectures. High-power and high-voltage elect…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
Utilization of Interconnections in Electronic Circuits as Magnetohydrodynamic Pumps for Liquid Metalbased Cooling
TS-062494 — A novel magnetohydrodynamic (MHD) pump-based thermal management system design where integration of the cooling apparatus using electronic circuit interconnections achieves improved thermal management at a lower cost.
Newer applications incorporating high-power electronics designs face greater thermal management challenges and impact systemic stability and reliability. Enhanced cooling techniques in these complex electronic systems rely on liquid cooling instead of air cooling. However, liquid cooling approache…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
Modular Dc Circuit Breaker with Integrated Energy Storage for Future Dc Networks
TS-051200 —
Traditional AC distribution is not suitable for a wide range of applications in regard to efficiency, cost, and power carrying capacity compared to alternative distributions. Low voltage distribution suffers from high transmission losses due to higher current requirements necessitating thicker, he…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Na, Risha; Zhang, Yue
- Licensing Officer: Ashouripashaki, Mandana
A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
- College: College of Engineering (COE)
- Inventors: Lyu, Xintong; Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
Methods and Apparatus to estimate phase of radiofrequency field
TS-037437 — A technique for estimating magnetic resonance imaging absolute phase to enhance machine efficiency and versatility.
Estimating absolute phase of Radiofrequency (RF) field including both the transmit field and receive sensitivity is very important for various stages of the magnetic resonance imaging (MRI) procedure. It can be used for mulit-transmit, RF shimming, parallel imaging reconstruction, electric propert…
- College: College of Arts & Sciences
- Inventors: Wang, Jinghua; Ding, Yu
- Licensing Officer: Panic, Ana
A Voltage Divider based Auxiliary Power Unit for Power Electronic Converters
TS-035666 — A more reliable, less complex, and cost effective concept for providing auxiliary power to high voltage electronic converters without external power sources.
Power electronic converters need a certain type of auxiliary power unit to provide electric power to their controllers, gate-driving circuits and/or sensors. For power electronic converters used in high voltage systems, the auxiliary power unit is difficult to design and fabricate due to massive e…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Hu, Boxue; Li, He
- Licensing Officer: Ashouripashaki, Mandana
Power Over Fiber Based Gate Drive Circuit
TS-015120 — The introduced power over fiber based gate drive circuit can be used drive semiconductor devices in a wide range of applications.
Recently, interest in high-voltage (HV) Silicon Carbide (SiC) based semiconductor power devices and their applications has grown. Many HV SiC based semiconductor power devices have been developed to date. The gate drive circuit of HV SiC power devices is critical to ensure fast and reliable switch…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Li, He; Zhang, Xuan
- Licensing Officer: Ashouripashaki, Mandana
