Available Technologies
# of Displayed Technologies: 6 / 6
Applied Category Filter (Click To Remove): Semiconductors, Circuits, & Electronic Components
Utilization of Inductors in Electronics Circuits as Magnetohydrodynamics Pumps for Liquid Metal based Cooling
TS-062498 — Novel integrated inductor-based magnetohydrodynamic (MHD) pumps containing liquid metal coolant significantly enhance the thermal management of large-scale, complex electronic systems housed in confined spaces
Conventional thermal management methods such as air-cooling and liquid cooling methods commonly used for electronics present in laptops, desktop computers, and smaller electronic configurations show limitations when scaled up for complex electronics architectures. High-power and high-voltage elect…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
Utilization of Interconnections in Electronic Circuits as Magnetohydrodynamic Pumps for Liquid Metalbased Cooling
TS-062494 — A novel magnetohydrodynamic (MHD) pump-based thermal management system design where integration of the cooling apparatus using electronic circuit interconnections achieves improved thermal management at a lower cost.
Newer applications incorporating high-power electronics designs face greater thermal management challenges and impact systemic stability and reliability. Enhanced cooling techniques in these complex electronic systems rely on liquid cooling instead of air cooling. However, liquid cooling approache…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Fan, Junchong
- Licensing Officer: Ashouripashaki, Mandana
A lightweight, miniaturized, and portable readout circuits for tracking LRC-based wireless sensor
TS-061832 — A portable and lightweight readout circuit designed for use with LRC-based wireless sensors and in conjunction with other commonly used devices (e.g., smartphone, laptop, and tablet)
The Need
Conventional vector network analyzers are bulky and expensive and tend to limit the ability to be used for daily tracing or high-frequency health status tracking in people. To overcome this and other limitations present in the cumbersome designs of today, compact-sized devices that take ad…
- College: College of Engineering (COE)
- Inventors: Li, Jinghua; Liu, Tzu Li
- Licensing Officer: Ashouripashaki, Mandana
Modular Dc Circuit Breaker with Integrated Energy Storage for Future Dc Networks
TS-051200 —
Traditional AC distribution is not suitable for a wide range of applications in regard to efficiency, cost, and power carrying capacity compared to alternative distributions. Low voltage distribution suffers from high transmission losses due to higher current requirements necessitating thicker, he…
- College: College of Engineering (COE)
- Inventors: Wang, Jin; Na, Risha; Zhang, Yue
- Licensing Officer: Ashouripashaki, Mandana
Capacitive Sensing Method for Integrated Circuit Identification and Authentication
TS-048641 — A method of authenticating an IC die’s origin and uniquely identifying each die with an intrinsic unclonable value through measurement of on-chip capacitance values
Hardware security in Integrated Circuit (IC) designs is of increasing importance in dealing with the insecure, expanding global supply chain of these parts. The ability to trace the origin of a die, combined with the capability to uniquely identify each die provides valuable quantitative measures …
- College: College of Engineering (COE)
- Inventors: Khalil, Waleed; Kines, Michael
- Licensing Officer: Ashouripashaki, Mandana
A Lightweight Low Inductance Power Module with Insulated Baseplates
TS-048588 — A lightweight power module that reduces loop stray inductance while maintaining good electrical insulation and thermal dissipation.
In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…
- College: College of Engineering (COE)
- Inventors: Lyu, Xintong; Wang, Jin
- Licensing Officer: Ashouripashaki, Mandana
