# of Displayed Technologies: 10 / 15

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Cost-Effective Modular Multilevel Flying Capacitor Converter for HVDC and Grid Applications
TS-072584 — The Need High-voltage DC (HVDC) transmission and grid-connected power conversion systems face significant cost, size, and efficiency challenges due to the large number of expensive submodules and capacitors required in conventional modular multilevel converters (MMC). These limitations restrict scal…
  • College: College of Engineering (COE)
  • Inventors: Fu, Pengyu; Cong, Yizhou; Ma, Dihao; Wang, Ke; Wang, Jin
  • Licensing Officer: Ashouripashaki, Mandana

Heat Flux Sensors Using Re4Si7 in a Transverse Thermoelectric Device Configuration
TS-072270 — The Need Current heat flux sensors rely on indirect temperature gradient measurements across thick materials, resulting in slow response times and limited sensitivity. There is a growing demand for compact, fast, and highly sensitive heat flux sensors for various applications. Existing technologies …
  • College: College of Arts & Sciences
  • Inventors: Goldberger, Joshua; Heremans, Joseph; Windl, Wolfgang
  • Licensing Officer: Ashouripashaki, Mandana

Topological Surface State-Based Thermal Switch
TS-070531 — The Need Efficient heat switches are crucial for various applications, including solid-state refrigeration, solar thermal installations, waste heat scavenging, and electronics cooling. Current technologies often suffer from irreversible thermodynamic losses or inefficiencies, limiting their effectiv…
  • College: College of Engineering (COE)
  • Inventors: Heremans, Joseph; Kang, Joon Sang; kim, Min Young
  • Licensing Officer: Ashouripashaki, Mandana

A device for improving the breakdown performance of gallium oxide semiconductors
TS-067551 — Gallium Oxide (Ga2O3) is an inorganic compound with semi-conductivity properties (e.g., a large bandgap) that can be used for developing power electronics, UV photodetectors, solar cells, and sensors. βeta-Ga2O3, a polymorph, has a distinct advantage over other semiconductors that have high cri…
  • College: College of Engineering (COE)
  • Inventors: Dheenan, Ashok; Dhara, Sushovan; Rajan, Siddharth
  • Licensing Officer: Ashouripashaki, Mandana

Monolithically Integrated Tunnel Junction-Based GaN Light Emitting Transistors
TS-065398 — Emissive display technologies (e.g., OLEDs) are display technologies that emit light directly to produce images. Unlike reflective displays, which rely on external light sources, emissive displays generate light, resulting in vibrant and high-contrast visuals. These next-generation displays are used in several applications, including mobile devices, AV/VR headsets, and wearable devices.
Although emissive displays are integrated into many electronic devices, they face some challenges. One of the primary issues is the integration of LEDs and electronic drivers when scaling into mesa dimensions. The mesa is a crucial parameter in display manufacturing as it determines the size of th…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; Jamal-Eddine, Zane; Joishi, Chandan "Chandan"; Rahman, Sheikh Ifatur
  • Licensing Officer: Ashouripashaki, Mandana

High-K Dielectric barriers to suppress internal photoemission photocurrents
TS-063471 — In an increasingly digital world, the demand for efficient and reliable photodetectors is paramount. These devices are critical for a variety of applications, from medical imaging to defense systems. However, traditional photodetectors often struggle with low UV-visible rejection, limiting their e…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; McGlone, Joseph "Joe"; Wriedt, Nathan
  • Licensing Officer: Ashouripashaki, Mandana

Monolayer Etching of Wurtzite GaN/AlGaN/AlN Using Cyclic O2 Plasma and Atomic Ga/Al Flux Exposure
TS-063466 — In the rapidly evolving world of semiconductor technology, there is a growing demand for efficient and precise methods of etching Gallium Nitride (GaN)-based semiconductors. Traditional wet and dry etching processes often damage the GaN, compromising the quality and performance of the final produc…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; Dheenan, Ashok; Rahman, Sheikh Ifatur; Wriedt, Nathan
  • Licensing Officer: Ashouripashaki, Mandana

Surface barrier engineering using AlGaO/GaO
TS-063001 — A new method of surface barrier engineering that introduces a linearly graded (AlxGa1-x)2O3 cap layer. This improves the Schottky barrier at the surface which results in a higher breakdown field.
Ga2O3 is a promising ultra-widebandgap semiconductor with many applications in power switching and RF electronics. Realizing those improvements requires efficient field management design to prevent premature breakdown due to electric field crowding at the device edges. There is a need to develop t…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; Dhara, Sushovan
  • Licensing Officer: Ashouripashaki, Mandana

Utilization of Inductors in Electronics Circuits as Magnetohydrodynamics Pumps for Liquid Metal based Cooling
TS-062498 — Novel integrated inductor-based magnetohydrodynamic (MHD) pumps containing liquid metal coolant significantly enhance the thermal management of large-scale, complex electronic systems housed in confined spaces
Conventional thermal management methods such as air-cooling and liquid cooling methods commonly used for electronics present in laptops, desktop computers, and smaller electronic configurations show limitations when scaled up for complex electronics architectures. High-power and high-voltage elect…
  • College: College of Engineering (COE)
  • Inventors: Wang, Jin; Fan, Junchong
  • Licensing Officer: Ashouripashaki, Mandana

Utilization of Interconnections in Electronic Circuits as Magnetohydrodynamic Pumps for Liquid Metalbased Cooling
TS-062494 — A novel magnetohydrodynamic (MHD) pump-based thermal management system design where integration of the cooling apparatus using electronic circuit interconnections achieves improved thermal management at a lower cost.
Newer applications incorporating high-power electronics designs face greater thermal management challenges and impact systemic stability and reliability. Enhanced cooling techniques in these complex electronic systems rely on liquid cooling instead of air cooling. However, liquid cooling approache…
  • College: College of Engineering (COE)
  • Inventors: Wang, Jin; Fan, Junchong
  • Licensing Officer: Ashouripashaki, Mandana

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