Available Technologies
# of Displayed Technologies: 3 / 3
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Lightweight CNT-Polymer Composite Wires with Enhanced Conductivity and Ampacity
TS-072578 — The Need
Current lightweight conductors, such as copper and aluminum, face limitations in specific electrical conductivity, flexibility, and thermal management, especially for demanding applications in electrified transportation and aerospace. There is a critical need for conductors that combine hig…
- College: College of Engineering (COE)
- Inventors: Sumption, Michael; Guo, Yang; Xue, Shengchen
- Licensing Officer: Ashouripashaki, Mandana
Heat Flux Sensors Using Re4Si7 in a Transverse Thermoelectric Device Configuration
TS-072270 — The Need
Current heat flux sensors rely on indirect temperature gradient measurements across thick materials, resulting in slow response times and limited sensitivity. There is a growing demand for compact, fast, and highly sensitive heat flux sensors for various applications. Existing technologies …
- College: College of Arts & Sciences
- Inventors: Goldberger, Joshua; Heremans, Joseph; Windl, Wolfgang
- Licensing Officer: Ashouripashaki, Mandana
Surface barrier engineering using AlGaO/GaO
TS-063001 — A new method of surface barrier engineering that introduces a linearly graded (AlxGa1-x)2O3 cap layer. This improves the Schottky barrier at the surface which results in a higher breakdown field.
Ga2O3 is a promising ultra-widebandgap semiconductor with many applications in power switching and RF electronics. Realizing those improvements requires efficient field management design to prevent premature breakdown due to electric field crowding at the device edges. There is a need to develop t…
- College: College of Engineering (COE)
- Inventors: Rajan, Siddharth; Dhara, Sushovan
- Licensing Officer: Ashouripashaki, Mandana
