The presence of counterfeit integrated circuits (commonly referred to as “ICs” or “chips”) in a supply chain, such as a military supply chain, can result in either a failure of a critical system or a compromise of the data on that system. These counterfeit chips may not be …

Zn-IV-N2 and Mg-IV-N2 compounds have been reported to be synthesized by a number of techniques including chemical vapor deposition (CVD), vapor-liquid-solid (VLS) technique, ammonothermal synthesis, radio frequency (RF) sputtering, pulsed laser deposition, molecular beam epitaxy (MBE) and metalorg…

Hardware security in Integrated Circuit (IC) designs is of increasing importance in dealing with the insecure, expanding global supply chain of these parts. The ability to trace the origin of a die, combined with the capability to uniquely identify each die provides valuable quantitative measures …

Gallium Nitride (GaN)-based devices are promising for high frequency and power applications because they have a superior combination of the critical electric field, electron mobility, saturation drift velocity, and power density. With the recent interest in solid-state power electronics technologi…

Universally Unique Identifiers (UUIDs) in Bluetooth Low Energy (BLE) Devices are vital for nearby smartphone applications to discover them. BLE has also been increasingly used by Internet of Things (IoT) devices in various areas such as transportation, healthcare, wearables, retail, and smart home…

The coming age of autonomous vehicles will require the development of many new technologies to keep the vehicle occupants safe even when no one is paying attention to the vehicle operation. At present, given the limited capabilities of autonomous vehicles, it is necessary for the driver to monitor…

In conventional power module structures, the die is attached to the substrate, usually direct bonding copper (DBC). The ceramic substrate layer provides electrical insulation between the circuit and cooling structure and attaches to a conductive baseplate material (Cu, Al, AlSiC) to dissipate heat…

As fuel efficiency standards for modern cars increase, manufacturers are adding more and more gears to their transmissions. The higher number of gears allows for greater gear spread, meaning engineers can add taller gears that allow engines to operate at lower, more fuel-efficient rpms. Despite…

Magnesium (Mg), the lightest structural metal, and its alloys, with their high specific strength and low density, are promising lightweight materials for industrial applications in automotive, aerospace, and electronic sectors. A 2019 report by Business Communications Company (BCC) Research highli…