Available Technologies

Available Technologies

# of Displayed Technologies: 10 / 160

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Modular Dc Circuit Breaker with Integrated Energy Storage for Future Dc Networks
TS-051200 — Traditional AC distribution is not suitable for a wide range of applications in regard to efficiency, cost, and power carrying capacity compared to alternative distributions. Low voltage distribution suffers from high transmission losses due to higher current requirements necessitating thicker, he…
  • College: College of Engineering (COE)
  • Inventors: Wang, Jin; Na, Risha; Zhang, Yue
  • Licensing Officer: Hong, Dongsung
Wireless Identification of Viral Infection (WiVi)
TS-051091 — This invention introduces a novel method for airborne viral pandemic mitigation using WiFi access points as infrastructural spatio-temporal anchors.
New viruses are constantly being discovered. From SARS to Bird Flu, and HIV to COVID-19. The threat of global pandemics is real and methods for tracing and controlling it need to be available. It is necessary that there are capabilities available which can inform the modeling of future viral spre…
  • College: College of Engineering (COE)
  • Inventors: El Gamal, Hesham
  • Licensing Officer: Hong, Dongsung
Concept Discovery from Text via Knowledge Transfer
TS-050856 — A better way for systems to organize, file, or index documents or content based on actual or anticipated information needed in the form of a user query or natural language question.
Data Processing and (IT)-related activities, ranging from web hosting to automated data entry services are more important than ever due to the large amounts of data collected through technology. According to IBIS World, "Companies will increasingly capture more data, requiring the outside exp…
  • College: College of Engineering (COE)
  • Inventors: Das, Manirupa; Fosler-Lussier, John Eric; Ramnath, Rajiv
  • Licensing Officer: Hong, Dongsung
Method of forming low turn on and high breakdown voltage lateral diode.
TS-050626 — A hybrid Schottky and metal/high K dielectric/semiconductor contact to realize higher breakdown and low turn-on voltage for lateral diode based on wide bandgap semiconductors.
Practical realization of high breakdown fields in wide bandgap semiconductors such as GaN, SiC, typically requires the use of p-n junction, which require a turn-on voltage comparable to the bandgap of these semiconductors. For lower voltage applications, the forward or ON-state power loss due to h…
  • College: College of Engineering (COE)
  • Inventors: Rahman, Mohammad Wahidur "Wahidur"; Rajan, Siddharth
  • Licensing Officer: Hong, Dongsung
Method for selective area doping of Gallium Nitride
TS-050625 — A method of selectively obtaining n- and p-type regions from the same III-Nitride layer deposited on a substrate without using diffusion or ion-implantation techniques.
According to IBIS World Reports, manufacturers of electronic components will likely refocus their production away from silicon-based products to wide bandgap (WBG) semiconductors, which are made of materials that have a wider bandgap than silicon. A bandgap, or energy gap, denotes the energy diffe…
  • College: College of Engineering (COE)
  • Inventors: Rajan, Siddharth; Chandrasekar, Hareesh; Rahman, Mohammad Wahidur "Wahidur"
  • Licensing Officer: Hong, Dongsung
Method for seamless joining and repair of metal parts using ultrasonic additive manufacturing
TS-050479 — This invention provides a method for repairing metal parts by removing and replacing worn, damaged, or defective metal material. It also serves as a method for seamlessly joining metal sheets and other parts while retaining the original temper of the joined parts. This technology, based on ultrasonic additive manufacturing (UAM), achieves strong joints and repairs by enabling the filling of a channel that has been cut, formed, or otherwise created in a metal structure or between two metal structures.
The aircraft industry lacks a robust method for joining metal sheets, structures, and assemblies together in wings, fuselages, and engines. Fusion based welding methods cannot always be used because they create heat-affected zones, which reduce the mechanical performance of material around the wel…
  • College: College of Engineering (COE)
  • Inventors: Dapino, Marcelo; Gingerich, Mark; Headings, Leon
  • Licensing Officer: Zinn, Ryan
Out-of-Plane Fluidic Actuator for Curved Surface Applications
TS-050464 — A novel bistable fluidic actuator design which uses naturally occurring fluid dynamic instabilities instead of moving parts to create an oscillating jet that is out-of-plane from the fluid inlet port.
Turbines are used to produce much of the world’s electricity, whether it be from nuclear, coal, or natural gas sources, as well as provide power for the vast majority of aircraft flying today. For many turbine applications, the first stage vane and blade just downstream of the combustor is a…
  • College: College of Engineering (COE)
  • Inventors: Hossain, Mohammad Arif "Arif"; Ameri, Ali; Bons, Jeffrey; Gregory, James "Jim"
  • Licensing Officer: Zinn, Ryan
Out-of-Plane Fluidic Actuator for Curved Surface Applications
TS-050464 — A novel bistable fluidic actuator design which uses naturally occurring fluid dynamic instabilities instead of moving parts to create an oscillating jet that is out-of-plane from the fluid inlet port.
Turbines are used to produce much of the world’s electricity, whether it be from nuclear, coal, or natural gas sources, as well as provide power for the vast majority of aircraft flying today. For many turbine applications, the first stage vane and blade just downstream of the combustor is a…
  • College: College of Engineering (COE)
  • Inventors: Hossain, Mohammad Arif "Arif"; Ameri, Ali; Bons, Jeffrey; Gregory, James "Jim"
  • Licensing Officer: Zinn, Ryan
Smart Platform for Engineered Electroceutical Dressings (SPEEDs) Enables Better Wound Care
TS-050245 — An integrated platform with multiple sensing modalities to actively orchestrate antimicrobial activity and wound healing.
Wound healing and disinfection for chronic wounds presents significant hurdles within the medical industry. Current state of art is inadequate and adds a significant cost burden to the healthcare system with many health and life-quality challenges for patients. After the formation of an open wound…
  • College: College of Engineering (COE)
  • Inventors: Prakash, Shaurya; Heald, Rachel; Mohana Sundaram, Prashanth; Narayanan, Kavya; Stoodley, Paul; Subramaniam, Vishwanath; Vilku, Gurleen; Wilgus, Traci; Wozniak, Daniel
  • Licensing Officer: Hong, Dongsung
Scalable laser-assisted MOCVD chamber design with laser array input
TS-050244 — A design of scalable laser-assisted MOCVD chamber for III-nitrides and other semiconductors with a laser array input.
III-nitrides represent an important semiconductor material system for both optoelectronic and power electronic device applications. Advantages for III-nitrides include high electron saturation velocity, high critical electric field, high radiation resistance and decent thermal performance. Therefo…
  • College: College of Engineering (COE)
  • Inventors: Zhao, Hongping; Chen, Zhaoying
  • Licensing Officer: Hong, Dongsung

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