TS-074715 — Next‑generation power electronics require devices that can operate efficiently under high voltages, high currents, and harsh environments while maintaining fast, reliable switching. Existing electrically gated solutions in wide and ultra‑wide bandgap semiconductors face tradeoffs among robustn…

TS-074383 — Many advanced sensing, imaging, and optoelectronic systems rely on compound semiconductors that outperform silicon in key spectral and electronic regimes, particularly in the infrared. However, these materials are expensive and difficult to scale, while silicon remains the industry standard for hi…

TS-074333 — Chemical batteries provide high power output but are constrained by finite stored energy and the need for periodic recharging. This is often impossible in remote, sealed, or radiation‑intensive environments such as space systems, subsea platforms, and isolated terrestrial installations. Radiovol…

TS-074084 —

TS-073810 — Next-generation power electronics demand materials that can support ultra-high breakdown voltages, low leakage currents, and scalable manufacturing. While β-Ga₂O₃ is highly attractive for these applications, device performance has been limited by the lack of high-quality, thick drift layers w…

TS-073809 — High-sensitivity detection in the mid-wave and long-wave infrared (MWIR/LWIR) remains constrained by detector noise, limited gain, and manufacturing challenges. While HgCdTe avalanche photodiodes can deliver excellent performance, they suffer from high cost, low yield, and limited manufacturabilit…

TS-073712 — Advanced quantum technologies, cryogenic sensors, and space instrumentation increasingly require reliable, compact cooling below 1 K. Today’s sub-Kelvin refrigeration relies heavily on dilution refrigerators and gas-gap thermal switches that are complex, slow, mechanically fragile, and dependent…

TS-073373 — Next‑generation power electronic systems require devices that deliver high breakdown voltage, large current handling, and fast switching while maintaining manufacturability at scale. Vertical FinFETs offer compelling performance advantages over incumbent bipolar and planar technologies, but thei…

TS-072841 — Modern thermal management demands fast, accurate, and spatially compact heat flux sensing to complement temperature measurements, enable real‑time control, and estimate internal temperatures without waiting for equilibrium. Conventional longitudinal thermopower sensors trade sensitivity for resp…

TS-072584 — The Need High-voltage DC (HVDC) transmission and grid-connected power conversion systems face significant cost, size, and efficiency challenges due to the large number of expensive submodules and capacitors required in conventional modular multilevel converters (MMC). These limitations restrict scal…